NEOCAB® NEOCAB PV Interconnect® is a copper-based flat wire used to connect silicon cells electrically and to carry out current in crystalline silicon and thin-film photovoltaic modules.
Extra soft NEOCAB PV Interconnect® reduces cell breakages and reduces electrical resistance in modules. Combined with consistent quality, excellent spooling and straightness.
Our Interconnect Wire is rolled from round wire in a proprietary process, then solder coated on all four sides. This combination of processes results in superior coatings and a completely burr free product. Our PV Ribbon products are produced from the highest quality material with each order engineered to your dimensional and physical property specifications.
The latest annealing and plating technology in interconnect PV ribbon products is completely chemical-free and compatible with new lead-free soldering alloys and saves energy. It was developed to help our customers to improve their production yield and product performance.
PV RIBBON is a hot dip solder coated copper conductor of flat shape used in photovoltic solar panels.
The Interconnect ribbon is directly soldered onto silicon crystal to interconnect solar cells in a solar panel.The interconnect ribbon carries the current generated in solar cells to PV bus-bar.
PV Bus-bar is a hot dip tinned copper conductor installed around perimeter of the solar panels. PV bus-bar connect interconnect ribbon to the junction box.
NEOCAB-PV is rolled from high purity oxygen free copper round wire and is hot dipped tinned. This state-of-the-art manufacturing technology gaurantees consistent quality. We provide all typical coatings, including Silver based and RoHS compliant lead-free coatings.
NEOCAB-PV® is rolled from high-purity oxygen-free copper round wire and is hot-dip tinned. This state-of-the-art manufacturing technology guarantees consistent quality. We provide all typical coatings, including Silver based and RoHS compliant lead-free coatings.
Every client has their unique needs so we cater every request individually. Our technical teams work closely with our Market research team to choose the right product for client’s application and to design a solution that works.
With NEOCAB-PV’s RIBBON a larger base copper cross-section is possible, improving the ELECTRON flow across cells, improving overall WATT output of each module.
NEOCAB-PV’s soft copper has a yield strength well below 60 N/mm² in normal production, which means there is less tension on the solar cells during soldering – so cell breakage is much less likely, which improves overall efficiency of solar PV-Module assembly.
NEOCAB-PV® can produce extremely flat ribbon to the tightest tolerances of thickness and width. We roll from round-wire to deliver burr-free, high-consistency ribbon; and our coating process gives 100% coverage so there’s no risk of discolouration.
With a high-purity oxygen-free copper core base, NEOCAB-PV® SF offers exceptional electrical conductivity combined with guaranteed elongation and yield strength. NEOCAB-PV SF provides enhanced mechanical properties to reduce cell breakage. It makes the solar module more fatigue resistant against weather changes during its lifetime
| PV Interconnect Ribbon & PV Busbar Range | |||
|---|---|---|---|
| Interconnect Ribbon | Busbar | ||
| Available Sizes | Width(mm) | 0.8 ≈ 2.5 | 3.0 ≈ 8.0 |
| Thickness(mm) | 0.1 ≈ 0.3 | 0.1 ≈ 0.4 | |
| Standard Coating Thickness | ≥20μm (Single Side) | ||
| Lead Coating | |||
| Sn60Pb40 | Sn62Pb36Ag2 | - | |
| Coating Type | RoHS Complianced (Lead Free) Coating | ||
| Sn100 | Sn96Ag35 (Tin96.5% , Silver 3.5%) | SnAgCu | |
| Softness | Elongation | Yield Strength | - |
| Flexible | ≥25% | ≤70 | |
| Supper Flexible | ≥30% | ≤60 | |
| Extream Flexible | ≥35% | ≤55 | |
| Quality | Confirms To | Semi PV-19 0811, Semi PV-18 0811 | |
| An ISO 9001-2008 Certified COmpany | |||
| Base Metal Specification | ||
|---|---|---|
| Specification Of the CORE Base Metal (Copper) | ||
| Interconnect Ribbon | Busbar | |
| Copper Grades | Cu-Etp | |
| Cu-OF | ||
| Resistivity | ≤ 1.707 x10-8 ῼmm2 @20° c | |
| Density | 8.89 gm/cm3 | |
| Conductivity (100% min) | ≥ 101 % | |
| Tolerance Value | ||
| Thickness Tolerance | ± 0.008 mm | |
| Width Tolerance | ± 0.080 mm | |
| Specifications Of The Solder COating | ||
|---|---|---|
| Interconnect Ribbon | Busbar | |
| Tin Coating Thickness | ≥20μm (**Other Thickness is available on request) | ≥20μm (**Other Thickness is available on request) |
| Tin Thickenss Coating Error | ±0.005 mm | ±0.009 mm |
| Type Of Coating And Composition | Curing Temperature (°c) | Liquefaction Temperature(°c) |
| Leaded (Non-RoHS) 60Sn40Pb | 183 °c | 190 °c |
| Leaded (Non RoHS) 62Sn36Pb2Ag | 179 °c | 189 °c |
| RoHS Complianced Lead Free 96.5Sn3.5Ag / Sn100 / SnAgCu | 221 °c | 221 °c |
| Observed Value Of NEOCAB PV Interconnect Ribbon & Busbar | ||
|---|---|---|
| Testing Name | Interconnect Ribbon | Busbar |
| Dimensions Tolerance | ±0.008 mm X ±0.08mm | ±0.016 mm X ±0.010mm |
| Straightness | ≤4mm / 1000mm | ≤3mm / 1000mm |
| Solder Coating Thickness Tolerance | ±0.005mm | ±0.009mm |
| Tensile Strength | 135 Mpa ≤ Ts ≤ 250 Mpa | 135 Mpa ≤ Ts ≤ 250 Mpa |
| Yield Strength (Rp0.02%) | 50 MPa ≤ Ys ≤ 70 Mpa | ≤ 130 Mpa |
| Elongation | ≥ 25 % | ≥ 25 % |
| Electrical Resistivity | ≤ 2.2 X 10-8 ῼm@20 °c | ≤ 2.2 X 10-8 ῼm@20 °c |
| Salt Atmosphere Test | 168h | 168h |
| Bending Radius | ≥ 7 Times | ≥ 7 Times |
| High Temprature and High Humidity | 1000h | 1000h |
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